Yole Developpment recently gave a webinar based on their
fall 2012 report on the CMOS Image Sensor Market. For those of you who didn’t
attend it, lets look at some of the interesting facts that they presented.
The CIS module value chain can be broken out into segments
consisting of front end chip fab, optical layers, back end / packaging and
module assembly and test. The figure below shows their estimated market values
in 2012.
The market is seen evolving...
Revenue by application is shown in the figure below. By 2016,
revenue should exceed $10B with mobile handsets and consumer applications, such
as accounting for most of that revenue.
In 2011 OmniVision, Samsung and Sony were responsible for
50% of the $5.8B market. Taiwan, Korea and Japan accounting for 80% of the
total market.
The low end market segments include cell phones, toys and
bar code readers. The evolving high end market segments include medical, DSLR
cameras, automotive, machine vision, surveillance etc.
BSI technology will have taken 50% of the overall
market by 2015.
The next generation technology will be 3D stacking which is
already being introduced by Sony [ see IFTLE 112 "TSMC Staffing up or 2.5/3D expansion; Semi 3D Standards; Sony Shows off 3D Stacked Image Sensors"]
No comments:
Post a Comment