- stacking of memory die (low power)
Sunday, July 28, 2013
Sunday, July 21, 2013
(1) stresses that are generated can cause cracks in thinned wafers, especially those containing TSV.
(2) slide debond normally conducted > 200 C which accelerates solder diffusion .
(3) cannot slide debond if already on dicing frame since no dicing tapes can take temps > 200 C.
Thursday, July 11, 2013
Wednesday, July 3, 2013