First things first
A message
from Hannah (9) and Madeline (5):
2013 IWLPC
The 2013 IWLPC Conference was held in San Jose CA this
past fall. Letslo at a few of the key packaging papers.
Rudolph Technologies
Klaus Ruhmer
of Rudolph Technologies addressed the convergence of front end (FE), back end
(BE) and flat panel Display technologies that is happening in order to meet the
requirements of mid end packaging technologies such as 2.5D on interposer, 3D stacked chips or very thin
fan-out packages.
Back-end
patterning demand is moving well into the single digit micron range (< 5μm
L/S) for current high density applications. One way of reducing cost while
achieving such dimensions is to take
advantage of economy of scale brought about by larger format processing.
Glass
interposers for 2.5D lend themselves to diverge from traditional round wafer
form-factors and move to small rectangular panel sizes used early on by the FPD
industry. It is thought that processing such panels will require manufacturing
techniques which have previously been utilized for Flat Panel Display
manufacturing.
A cost analysis by Rudolph concludes
that a 1.7X cost reduction in lithography can be achieved by going from a 1X stepper and 300mm glass
wafers to a 550 x 650mm glass panel (gen 3 LCD panel) using their panel
lithography systems (all other things being equal).
Nanium
Nanium has
been recently involved with establishing 300mm production of FOWLP [ see IFTLE
124 “Status and the Future of eWLB; Will Deca lower the cost of FO-WLP ? “ ]
At the IWPC
they announced the 300mm scale up of FCI’s (Flip Chip Int) Spheron fan-in WLP
technology. They were able to show process capability and reliability on a
500um pitch test vehicle. They are in the process of evolving this to 350u
pitch.
Deca
We have
discussed the Deca adaptive patterning technology previously [see IFTLE 124 “Statusand the Future of eWLB; Will Deca lower the cost of FO-WLP ? “ ]
At the IWLPC
Boyd Rogers presented the reliability results for a 4X4mm2, 0.4mm pitch 72 IO test
vehicle shown below.
They are in
the process of doing board level cycling and drop testing.
450mm on Hold ??
Several reports including Paul Van
Gerven of Bits & Chip [link] and Charile Demergian of Semiaccurate [link] are reporting
that ASML has stopped 450 mm litho development.
While it has been widely reported
that volume production at 450-millimeter was scheduled to start in 2018 at the
10nm node, these recent announcements could indicate that this 2018 start date
might be optimistic.
For
all the latest in 3DIC and advanced packaging stay linked to IFTLE…
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