The undisputed Jewel of IC packaging conferences, the ECTC (Electronic Component Technology
Conference) took place this past week in Las Vegas with 1300+ attendees, 95
exhibitors and IFTLE in attendance.
Over 600 submitted abstracts resulted in ~300 presentations (verbal
and poster) and the highest rejection rate in the industry. Key to this years conference success were
Program Chair Beth Keser from Qualcomm, General Chair Wolfgang Sauter from
IBM, and Assistant Program Chair Alan
Huffman from RTI Int.
Beth Keser, Wolfgang Sauter and Alan Huffman from the ECTC Program
Committee
John Lau Wins IEEE CPMT
Field Award
Awards are an important part of this yearly conference and
the pre-imminent packaging award is IEEE CPMT’s (Component, Packaging and
Manufacturing Technology Society) “Field Award”
Past years winners include Rao Tummala (packaging), Yutaka Tsukada
(underfilling), Paul Totta (bumping);
Herb Reichl (packaging); George Harman (wire bonding), Dimitri Grabbe (connectors)
and CP Wong (polymers).
Bill Chen (ASE), CP
Wong ( GaTech ), John Lau ,wife Theresa and daughter Judy Celebrate his award
Other major award winners included:
Outstanding Contribution Award – Rolf Aschenbrenner,
Fraunhoffer IZM Berlin
Outstanding Sustained
Technical Contributions Award – Dongkai Shangguan, National Center for Advanced
Packaging – China
Exceptional Technical Achievement Award - Yong Liu, Fairchild
Electronic Manufacturing Technology Award – Louie Huang, ASE
This years event was also loaded with panel sessions including Broadcom’s Sam Karikalan chairing “The role
of Wafer Foundries in the Next Gen Packaging”; CPMT President Ricky Lee of Hong
Kong Univ of Science and Techniology, chairing “LEDs for Solid State Lighting”
( Lester Lightbulb was seen in tears
after he was informed that he was not selected to speak on this panel );
Amkor’s Lou Nichols chairing “Packaging Challenges Across the Wireless Supply Chain” and Fujitsu’s Yocouchi-san chairing “Low Loss
Dielectrics for High Frequency and High Bandwidth”
Without question the leading theme at this years conference
was once again 3DIC. I counted at least 12 sessions and numerous posters that
dealt with the various components of 2.5 and 3D technology.
3DIC Status
There were no major commercial announcements or major
technology advances in 3DIC.
Presentations tended to show slow
steady movement forward for both 3D and advanced packaging in general. Over the
next few weeks we will discuss this further and will take a look at some of the
more interesting presentations at this years ECTC.
IFTLE also thanks
Cornelia Tsang of IBM for guarding his seat during the ECTC gala celebration ! (inside
joke)
For all the latest on Advanced Packaging and
3DIC stay linked to IFTLE…………
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