Continuing
with our coverage of the March IMAPS DPC.
TI
In his
keynote presentation on semiconductor packaging trends Devan Iyer of TI showed a great chart on package shrinkage through
the years. We have moved from the 1.75mm SOIC to the picostar 2G at 0.075mm
which they claim to be the thinnest package available for portable products and
can be buried into PCB layers .
APSTL
Dev Gupta of APSTL examined
“Stacked package with improved bandwidth and power efficiency” . His
conclusions are based on the assumption
that 2.5/3D technology is still immature and high cost and not ready for
adoption in consumer products like smart phones. He is a proponent of what he
calls “super PoP” packages.
He points to
the recent presentations by JEDEC which indicated that TSV based wide IO would
be an option for 2015 but would find strong competition in LPDDR4. { For
further discussion of this issue see IFTLE 134,
“SEMI 3D European Summit – Is the Wide IO Driver Dead ?” ]
Gupta claims
that the issues for Pop arise from increased power loss due to parasitics in
the package and that this can be cured by inserting “signal conditioning chips
“ (442)
Nanium
Nanium
announced that they were installing 30mm
WL fan in technology (Spheron PBO technology from Flip Chip Int) to compliment
their WL fan out technology already in place.
Corning
Corning
discussed their 3D carrier glass substrates used in the wafer thinning
process.
They supply
glass carriers for the 3M temp bond / debond process. Their fusion glass
process results in surfaces with RMS 0.3nm; Ra 0.2 nm and Z range 4.2nm which
is better than lapped and polished glass.
200 & 300 mm wafers cut out of a sheet. 450 will not be
a problem and panels are ready when the industry becomes ready to use them.
They are using alumino-silicate glass (SGW3) to match CTE od
Si from 0 – 300 C. This CTE match keeps
warpage very low. Corning pointed out that measuring TTV on these wafers is
difficult and that reports in the literature of 1 um TTV are sometimes as far
off as 5 um.
Recycling glass wafers depends on all process perameters,
but in general they envision 15 recycles
as doable.
For all the latest in 3DIC and advanced packaging stay
linked to IFTLE………….
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