The last of our looks at September 2013s Semicon Taiwan.
DiscoDisco claims to have 73%of the edge trim business and 90% of the back grinding business.
Disco offers trimming before or after bonding as shown below. Trimming after bonding shows faster blade wear and lower throughput . Trimming before bonding requires additional cleaning before bonding.
Lowering the TTV (total
thickness variation) of temp bonding
materials improves the TTV of the
thinned silicon wafer. One option is to surface planarize the temp bonding
material.
Cleanliness during the grind and CMP operations can be
handled by integrated grind / CMP / clean units.
Disco offers both Blade and Laser Dicing.
Namics
Namics gave an update on CUF underfills for 2.5/3DIC. The
Namics roadmap for capillary underfill is shown below.
Only fine filler underfills can be used with TSV stacked
packages. Higher filler loadings are needed to reduce filler CTE.
Higher thermal conductivity CUF can be made by increasing
the filler content.
Vacuum assisted process or pressure assisted process can
both be used to decrease voiding in CUF.
Amkor
Choon Lee of Amkor gave a presentation on “From Advanced
Packaging to 2.5D/3D.
Interestingly Lee
predicted a silicon interposer cost of 2.7-4$/cm sq (100 sq mm) and
expectations of organic interposer costs at 50% cost reduction.
Lee showed the following example of converting a silicon
interposer to PCB.
For all the latest on 3DIC and advanced packaging stay
linked to IFTLE…….
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