Finishing our look at the June 2013 ConFab packaging
activities.
Amkor
Bob Lanzone, Sr VP of Engineering Solutions for Amkor, like
the other OSATS sees smartphones and tablets driving the market moving forward.
If you ever wondered who the key players were in each of the
mobile phone IC functions, Lanzone used this enlightening slide from Gartner.
Amkor's update on Copper Pillar technology indicates an
expected doubling in demand this year and continued expansion into “all flip
chip products”.
Their “TSV status” takes credit for being the first into
production with TSMC and Xilinx.
Looking at the 2.5D TSV & Interposer Supply Chain they
see:
• High End Products : Networking, Servers
- Silicon interposers ; < 2um
L/S, < 15nsec latency, > 25k μbumps per die
- Amkor is engaged with Foundries
to deliver silicon interposers today
• Mid Range Products : Gaming, Graphics, HDTV, Adv. Tablets
- Silicon or Glass interposers ; < 3um L/S,
< 25nsec latency, ~10k μbumps/die
- Not actively pursuing glass interposers yet
as infrastructure still immature
• Lower Cost Products : Lower End Tablets, Smart Phones
-
Silicon, Glass or Laminate interposer ; < 8um L/S, low resistance,
~2k μbumps
- Must provide cost reduction path to enable
this sector
- Working with laminate supply chain to enable
They are targeting 2014 for their “possum” stacking as shown
below:
Siliconware (SPIL)
In the presentation “The expanding Role of OSATS in the Era
of System Integration”, Mike MA , VP of R&D for SPIL looked at the
obstacles to 2.5/3D implementation and came up with the conclusion that cost is
still a significant deterrent to all segments.
He discusses the two current business models for 2.5D which
are the “foundry model” supported by TSMC and the “collaboration model “
supported by GF and UMC. He now adds a third model “the OSAT turnkey model
which is now supported by TSMC.
SPIL is the first OSAT to propose this OSAT centric model
where the interposer is fabricated by the OSAT who then assembles and tests
modules made with chips from multiple sources.
The impediment to this route in the past has been the lack of OSAT
capability to fabricate the fine pitch interposers which require dual damascene
processing capability, which until now was only available in the foundries.
SPIL has now announced the equipment for
fine pitch interposer capability (>2 layers, 0.4-3um metal line width and 0.5um
TSV ) has been purchased and is in place.
Ma indicates that while the foundries are not happy with this
SPIL proposal, their customers, especially their fabless customers have been
very supportive. He feels the inherent
lower cost structure of OSATS will have
a positive impact on the 2.5/3D market which has been somewhat stagnant since
the FPGA and memory product announcements in 2010.
SPIL also announced a wafer level fan out (WLFO) program on
370 x 470mm organic based panels which they feel is a potential low cost
solution for those with lower density interposer requirements.
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