IFTLE put together
two sessions on packaging which were
jointly sponsored by IEEE CPMT and ConFab.
The most significant packaging announcement from the ConFab
was SPIL announcing that they have put dual damascene in place and are ready to
start supplying high density interposers to the industry. [see “Siliconware announces entrance into high density 2.5D interposer market”].
Sony
CMOS Image Sensor 3D Stacking
Fellow bearded blogger Dick James of
Chipworks, in his presentation “inside Todays Hot Products” showed some great X
sections of the Sony IMX135 13 Mpixel CMOS Image sensor. One of the first
stacked image sensors it consists of a 90nm back illuminated sensor bonded F2F
with a 65nm image processor
IBM Orthogonal
Scaling
Subu Iyer , IBM Fellow, lectured on his theme of “orthogonal
scaling” . His premise is that classical silicon scaling is saturating and we
need orthogonal approaches to “scale all aspects of the system including
footprint and power”. Subu sees scaling continuing down to the 7nm node,
but “the cost per transistor has begun
to saturate”
He predicts that the next component of Advanced System
Integration will be 3D Integration:
- large
interposer platform for heterogeneous integration
- Die Stacking
- stacking of logic die (high and moderate power)
- Wafer level
stacking
His example of
stacked memory is the Micron IBM program on stacked memory:
TI Thins Down Packaging
Devan Iyer, worldwide Dir. of Packaging for TI showed the
thickness progression from the 1.75mm SOIC to the 0.075mm PicoStar-2G
Iyer points out that while Package families are proliferating, each package type has a “sweet
spot” combination of cost, performance, form factor and reliability, driven by:
•Cost
•Electrical speed, power distribution and noise immunity
•Power dissipation
•Thickness, weight, PCB area consumption
•Board level reliability (BLR, drop)
•Environmental reliability
•Technical maturity vs. risk in high-volume manufacturing
•Testability
•Compatibility with Si process
STATS
Anderson of
STATSChipPAC points to smartphones and
tablets driving our industry right now.
For all the latest on 3DIC and Advanced Packaging stay linked
to IFTLE.........
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