SEMI European 3D Summit
SEMI Europe held
their first European 3D TSV Summit in Grenoble in late January with a theme of “On
the Road towards TSV Manufacturing”. Yann Guillou of Semi reports 320 attendees
from 20 countries, 4 keynotes speakers, 22 invited speakers and 22 exhibitors
were in attendance.
ST Micro
ST Micro
presented their strategy for bringing 3D to manufacturing. An interesting slide
compared yields with and without TSV.
They discussed
digital / analog partitioning and memory on application processors as driving
applications.
ST Ericsson
Kimmich of ST
Ericsson discussed the application of 3D integration to smartphones. They were
hyping fully depleated SOI technology (FD SOI) as being a faster, cooler and
simpler solution.
He reported
successful results from their WIOMING 3D application processor [ see IFTLE 86,
“ 3D Headlines at the RTI 3D ASIP part Deux” and IFTLE 130 “3D-ASIP part 3,Wioming…”]
A cross
section of the device is shown above ( STM wide IO memory on applications
processor). The goal is to offer the same bandwidth as a quad channel 32 bit
LPDDR2 interface but with half the power consumption. These are 10um dia TSV on
40 um pitch with AR = 8. The Cu pillar connections are 20um dia on 40 um pitch
. ST Ericsson reports there are still
business issues concerning the wide IO business model.
An interesting
chart on Memory Options shows wide IO bandwidth capability the same as LPDDR3
although the DDR memory takes a significant hit in power efficiency.
Another
interesting conclusion is that PoP memory solutions offer better thermal
performance since the thinned Si die in the 3D configuration result in poor
lateral heat distribution.
In fact, Kimmich concludes that although 3D TSV technology
appears ready for mass production, wide IO technology is not yet a fit for
mainstream smartphones. LPDDR3 and LPDDR4 will be used in this application due
to better thermal performance and lower cost.
GolbalFoundries
Greenwood of
GF reitereated their recent theme of global collaboration enabling the global
supply chain. Of interest was his slide outlining the production at various GF
sites.
When it comes
to 2.5/3D, GF is certainly well engaged across the world. The Fraunhoffer ASSID
being on the same campus as Fab 1 Dresden is strategically aligned to GF
collaboration. This co location insures “…an intensive and frequent knowledge
exchange at the engineering level”.
AS IFTLE has
reported previously see IFTLE 125, “2012 GaTech Interposer Conference, part I”,
Fab 8 in NY is responsible for 3D solutions and Fab 7 in Singapore is
responsible for 2.5D solutions.
Several 2.5D
test structures were shown that were collaborations with Amkor.
For all the
latest info on 3DIC and advanced packaging stay linked to IFTLE…………
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