Continuing
our look at the 2013 GaTech Interposer Conference.
Amkor
Ron
Huemoeller of Amkor addressed interposer use, defining the markets and
materials options as follows:
Amkor
projects that in the high end silicon will dominate; in the mid end silicon
will be prominent and organic /glass may play a role; in the low end organic,
or low cost glass or silicon if they exist will play a role.
Silicon Interposers
Product Applications
- Gaming,
HDTV, mobile tablets, computing, servers
- High end
graphics cards will be the initial focus of HBM memory integration
- mobile
space has the potential to follow based on availability of low cost solutions
Visible and Anticipated Demand
- continued
low volume production of FPGAs and ASICs
- moderate
volumes for high end graphics cards; HBM cost/availability driven
- high
volumes for mobile; interposer cost driven at less than $0.01 per sq mm.
- expect to
have a very long life cycle
- long term
continued use through deconstruction of very high end node logic to address
system level cost and power related memory integration issues.
Amkor
describes the silicon interposer supply chain
- Current
-
TSMC – not supplying to the industry
-
UMC and Global Foundries – both have limited capacity and neither desires to be
a merchant supplier
-
Future
-
Yet unannounced merchant supplier
-
use of depreciated equipment and excess capacity
-
lowers cost vs tier 1 foundries
-
supply interposer without desire to bundle chip fab.
Organic
Interposer Sources:
-
Tier 1 Shinko, SEMCO
-
2/2 (L/S) 10/22 (via/pad); very limited sampling
-
Tier 2 Kyocera
-
5/5 (L/S); 18/30 (vias/pads); very limited sampling
-
Tier 3 Kinsus, Unimicron
-
early development
Dave McCann
of GlobalFoundries examined market needs for interposers. McCann used the
latest Gartner data on SoC costs to point out that development costs for a 10nm
design are expected to approach $400MM.
GF again made
the case that “DIS-integration” can actually offset scaling costs, i.e.:
GF indicates
that the yield of high density interposers is high (“..approaching 100%”), even
for full retical sized; 4 metal layer
top side, 1 metal layer backside structures.
GF has come up with the following roadmap for
silicon, high density laminate and glass.
Like Amkor,
GF has mapped 2.5D requirements by market space and come up with the following.
Also similar
to Amkor GF pointed out that the industry needs a low cost high volume source
of high density interposers. Although
showing their capabilities for interposer fabrication, interestingly they did
not offer themselves up as the solution.
For all the
latest on 3DIC and advanced packaging stay linked to IFTLE………….
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