Apologies
for the delay in covering the IMAPS device packaging conference this year. I normally
get access to the manuscripts as I am leaving the show to insure timely coverage.
This year that was not possible. IMAPS' move of their office to the RTP NC area is
causing further delays (they will soon be my neighbors), so I await the
conference CD like the rest of the attendees.
Personnel Changes in Taiwan
The
word from Taiwan is that Doug Yu, who has been responsible for the R&D of
exploratory technologies including FEOL, BEOL and 3D IC has been refocused on just
packaging, especially their CoWoS 2.5D offering. IFTLE thinks this move shows that TSMC is serious
about expanding this business within
their company.
We
also hear that Ho Ming Tong currently General Manager and Chief R&D
Officer at ASE, who has been a strong supporter of 3DIC, and is actually
credited with coining the phrase 2.5D, is moving further up the corporate ladder at
ASE.
Congrats
to both gentlemen!
A grid of application vs function would look something like
this.
The market breakdown by end application is shown below with
MEMs and image sensing being responsible for over 50 percent of the market for more
than the next five years..
Total market glass market is reported to be $158M in 2012. Schott (Germany) , Tecnisco
(Japan), PlanOptik (Germany), Bullen(USA) and Corning (USA) reportedly share
70 percent of the market, driven mainly by demand for WL capping [CIS application (see
below)].
CS wafer level glass capping is shown below .
For all the latest on 3DIC and advanced packaging, stay
linked to IFTLE.
No comments:
Post a Comment