tag:blogger.com,1999:blog-8243243566305331519.post4073250900511970325..comments2023-08-07T06:02:27.904-07:00Comments on Insights From the Leading Edge: IFTLE 4 Are We All Suffering From 3D Stress ?Unknownnoreply@blogger.comBlogger1125tag:blogger.com,1999:blog-8243243566305331519.post-56498138849437804322010-07-07T14:11:02.540-07:002010-07-07T14:11:02.540-07:00Phil, nice summary, I look forward to your other r...Phil, nice summary, I look forward to your other reports on 3D IC design flow.<br /><br />I think it will become more critical to understand the behaviour of TSV's when the 3D stacks become more main stream with functions as power management and sensors. With increasing current densities, thermal, electromigration & stress migration modeling at a system level will become a must have feature.<br /><br />Stacked system-level modeling and optimization tools for TSV's, RDL's and interposers are quite a challenge to integrate with the existing EDA tools. The multiobjective simulation at that level is not only resource-limiting but may limit the development of 3D stacks to more experimenting than upfront simulation. I have seen a couple of 3D integrators at the recent DAC 2010 at Anaheim. Though they leave a lot to be desired, I do think they are a good start. How ever, one dilemma is where do we integrate such capabilities? A stand-alone integrator, or, EDA tools, or TCAD tools?<br /><br />It took almost a decade for the mechanical/structural simulation industry to fully integrate their solutions within CAD tools (such as SolidWorks, ProEngineer, etch) and find user acceptance. I hope it takes lot less than that for the chip industry to evolve a 3D design environment.<br /><br />MP Divakar, PhD<br />Vice President<br />Concurrent Analysis Corp.Docdivakarhttps://www.blogger.com/profile/16690936491662985534noreply@blogger.com